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Sputtering target tungsten
Sputter targets made from tungsten carbide for the coating of high-performance tools and components
Why tungsten carbide?
With sputtering, a physical, vacuum-based coating procedure,...
Why tungsten carbide?
With sputtering, a physical, vacuum-based coating procedure,...
Sputtering target tungsten
Sputter targets made from tungsten carbide for the coating of high-performance tools and components
Why tungsten carbide?
With sputtering, a physical, vacuum-based coating procedure, sputter targets are used. Sputter targets made from tungsten carbide are mostly used for the production of DLC coatings (diamond-like carbon).
Why CERATIZIT?
Due to our own powder production and our comprehensive know-how in production processes, we guarantee a very pure microstructure without impurities or pores. Our sputter targets additionally distinguish themselves by means of a homogeneous microstructure which in turn is decisive for a consistent coating result. Depending on requirements we offer a variety of carbide grades with various properties.
Why tungsten carbide?
With sputtering, a physical, vacuum-based coating procedure, sputter targets are used. Sputter targets made from tungsten carbide are mostly used for the production of DLC coatings (diamond-like carbon).
Why CERATIZIT?
Due to our own powder production and our comprehensive know-how in production processes, we guarantee a very pure microstructure without impurities or pores. Our sputter targets additionally distinguish themselves by means of a homogeneous microstructure which in turn is decisive for a consistent coating result. Depending on requirements we offer a variety of carbide grades with various properties.
Placer electronics - max. 85 000 c/h, max. 26 300 cph/m² | NPM-D3
The Panasonic NPM-D2 Dual Lane Assembly delivers a seamless and efficient electronics assembly production process, all via a singular-platform. It features a switchable, plug-and-play...
Placer electronics - max. 85 000 c/h, max. 26 300 cph/m² | NPM-D3
The Panasonic NPM-D2 Dual Lane Assembly delivers a seamless and efficient electronics assembly production process, all via a singular-platform. It features a switchable, plug-and-play placement head collection, an adhesive dispense (ADH), a solder past inspection (SPI), and a post placement inspection (AOI).
The two heads of each Panasonic NPM-D2 model operates on both phases in order to achieve the full extent of the dual-lane primary feature of the apparatus. In addition, its dual-screen printer (DSP) feature is capable of executing parallel and concurrent printing of two separate compounds. This all results into an efficient production rating, brought about by this high-quality assembly.
The two heads of each Panasonic NPM-D2 model operates on both phases in order to achieve the full extent of the dual-lane primary feature of the apparatus. In addition, its dual-screen printer (DSP) feature is capable of executing parallel and concurrent printing of two separate compounds. This all results into an efficient production rating, brought about by this high-quality assembly.
SMT pick-and-place machine - max. 35 800 c/h | AM100
The AM100 was designed to evolve with fluctuating market needs while remaining a cost-effective solution to produce the necessary products with the necessary quality and within the necessary timing. Panasoniç's...
SMT pick-and-place machine - max. 35 800 c/h | AM100
The AM100 was designed to evolve with fluctuating market needs while remaining a cost-effective solution to produce the necessary products with the necessary quality and within the necessary timing. Panasoniç's...
Axial lead component insertion machine - max. 30 000 c/h | AV132
Introducing the AV132 Axial Inserter is a high-speed axial insertion machine designed to enhance the productivity...
Axial lead component insertion machine - max. 30 000 c/h | AV132
Introducing the AV132 Axial Inserter is a high-speed axial insertion machine designed to enhance the productivity rate at an optimum level. The unit features its compressed design and a 30,000 cph quality performance. Plus, it has a setting which surely adjusts to certain requirements so as to supply component inputs such as 40 and 80 mode. It can also provide another set up for future work load so as production will just continue.
Die bonder flip-chip - MDP-300
Our newest process-flexible, flip chip bonder combines flip chip, thermosonic, and thermocompression bonding in a single, small footprint solution.
Flexible bonding...
Flexible bonding...
Die bonder flip-chip - MDP-300
Our newest process-flexible, flip chip bonder combines flip chip, thermosonic, and thermocompression bonding in a single, small footprint solution.
Flexible bonding tools change from thermosonic to C4 to TCB processes directly. It also supports 300mm (12") wafer substrates. The MD-P300 is an ideal solution for COB hybrid assembly with an in-line Panasonic SMT placement machine.
Fast cycle times and placement accuracy of +/-5μm at 0.5 seconds per IC (dry run)with thermosonic and C4 processes at 0.65 seconds, including process times.
Features & Benefits
Process versatility
Ideal for processors and CMOS
& MEMS power devices
Fast and accurate
Flexible bonding tools change from thermosonic to C4 to TCB processes directly. It also supports 300mm (12") wafer substrates. The MD-P300 is an ideal solution for COB hybrid assembly with an in-line Panasonic SMT placement machine.
Fast cycle times and placement accuracy of +/-5μm at 0.5 seconds per IC (dry run)with thermosonic and C4 processes at 0.65 seconds, including process times.
Features & Benefits
Process versatility
Ideal for processors and CMOS
& MEMS power devices
Fast and accurate
Die bonder fully-automatic - Esec 2009 SSIE
The Esec Die Bonder is a newly engineered die attach. It has a new point to line, pick and place...
Die bonder fully-automatic - Esec 2009 SSIE
The Esec Die Bonder is a newly engineered die attach. It has a new point to line, pick and place to deliver a speedy dispensing technology. It is easy to use because of the user-friendly menu and simple mechanical design. The Esec Die Bonder can be used for a wide range of applications such as handling ultra thin or ultra wide lead frames or process power modules.
Die bonder flip-chip - max. 350 °C | 2200 evo
The Datacon 2200 evo series of multi-module die attach machines from BESI, tends to applications...
Die bonder flip-chip - max. 350 °C | 2200 evo
The Datacon 2200 evo series of multi-module die attach machines from BESI, tends to applications on die attach and clip chips that need utmost versatility. It has an incorporated dispenser, a mechanized tool changer, and tools that are application specific. Also, it can handle 12 wafers at a time. All of these make the Datacon 2200 evo a timeless machine.
Die bonder - 2200 evoplus
Combining integrated dispenser and vision alignment with automatic tool and wafer changer...
Die bonder - 2200 evoplus
Combining integrated dispenser and vision alignment with automatic tool and wafer changer as well as pick and place head as its key features, Datacon 2200 evoplus die bonder is designed for multi-module attach technologies. It is suitable for applications that require optimum accuracy, productivity, flexibility, multi-chip capability and long-term stability.
Die bonder epoxy - Esec 2100 SC
The Die Bonder Esec 2100 SC is the most flexible 300 mm high speed platform, capable of running...
Die bonder epoxy - Esec 2100 SC
The Die Bonder Esec 2100 SC is the most flexible 300 mm high speed platform, capable of running the smart card tape. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership. At its introduction, this innovative platform was awarded with the prestigious Swiss Technology Award.
Die bonder epoxy - Esec 2100 xPplus
The Die Bonder Esec 2100 xPplus is a 300 mm high velocity platform designed for functional capacity operation such as...
Die bonder epoxy - Esec 2100 xPplus
The Die Bonder Esec 2100 xPplus is a 300 mm high velocity platform designed for functional capacity operation such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. This unit is the most affordable machine in terms of assisting the whole production operation to yield better output and development. Plus, this Die Bonder Esec 2100 xPplus boasts its excellency by having a recognized Swiss Technology Award which is given to leading invention across the globe.