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Die bonder flip-chip - max. 350 °C | 2200 evo
The Datacon 2200 evo series of multi-module die attach machines from BESI, tends to applications on die attach and clip chips that need utmost versatility. It has an incorporated dispenser, a mechanized tool changer, and tools that are application specific. Also, it can handle 12 wafers at a time. All of these make the Datacon 2200 evo a timeless machine.