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Die bonder fully-automatic - Esec 2009 SSIE
The Esec Die Bonder is a newly engineered die attach. It has a new point to line, pick and place to deliver a speedy dispensing technology. It is easy to use because of the user-friendly menu and simple mechanical design. The Esec Die Bonder can be used for a wide range of applications such as handling ultra thin or ultra wide lead frames or process power modules.