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Die bonder epoxy - Esec 2100 xPplus
The Die Bonder Esec 2100 xPplus is a 300 mm high velocity platform designed for functional capacity operation such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. This unit is the most affordable machine in terms of assisting the whole production operation to yield better output and development. Plus, this Die Bonder Esec 2100 xPplus boasts its excellency by having a recognized Swiss Technology Award which is given to leading invention across the globe.