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Printed circuit board thermally-conductive substrate PCB - Tlam IMPCB LLD04
Thermally Conductive PCB Substrate
Ultra-Bright Led Insulated Metal Printed Circuit Board Material
Tlam IMPCB LLD is a copper circuit layer and aluminum or copper...
Ultra-Bright Led Insulated Metal Printed Circuit Board Material
Tlam IMPCB LLD is a copper circuit layer and aluminum or copper...
Printed circuit board thermally-conductive substrate PCB - Tlam IMPCB LLD04
Thermally Conductive PCB Substrate
Ultra-Bright Led Insulated Metal Printed Circuit Board Material
Tlam IMPCB LLD is a copper circuit layer and aluminum or copper base plate bonded together with LLD dielectric. Tlam IMPCB LLD is processed through standard FR4 print and etch operations.
LLD is designed for bright and ultra-bright LED module applications. LLD products have 6-8 times better thermal conductivity compared to FR4, key to keeping components cool. LLD boards are processed through standard pick-and-place SMT and manual wire bond operations.
Standard constructions are made with 1 or 2 ounce copper and 0.040 (1) or 0.062 (1.6) inch (mm) thick aluminum.
Ultra-Bright Led Insulated Metal Printed Circuit Board Material
Tlam IMPCB LLD is a copper circuit layer and aluminum or copper base plate bonded together with LLD dielectric. Tlam IMPCB LLD is processed through standard FR4 print and etch operations.
LLD is designed for bright and ultra-bright LED module applications. LLD products have 6-8 times better thermal conductivity compared to FR4, key to keeping components cool. LLD boards are processed through standard pick-and-place SMT and manual wire bond operations.
Standard constructions are made with 1 or 2 ounce copper and 0.040 (1) or 0.062 (1.6) inch (mm) thick aluminum.
Printed circuit board flexible - TYPE I
a single conductor layer laminated to dielectric providing point-to-point connection with access from either one or two sides. The choice for...
Printed circuit board flexible - TYPE I
a single conductor layer laminated to dielectric providing point-to-point connection with access from either one or two sides. The choice for High Density Edge Connection (HDEC) applications.
Benefits of Single-Sided Flexible Printed Circuits:
Simplified design and manufacture
Low acquisition costs
Minimized interconnect errors / higher reliability /reduced assembly costs
Greater durability when used in dynamic applications
Neater/cleaner system appearance
Ability to reduce packaging sizes
Benefits of Single-Sided Flexible Printed Circuits:
Simplified design and manufacture
Low acquisition costs
Minimized interconnect errors / higher reliability /reduced assembly costs
Greater durability when used in dynamic applications
Neater/cleaner system appearance
Ability to reduce packaging sizes
Printed circuit board flexible / double-sided - TYPE II
Two conductor layers separated by laminated dielectric usually with plated through holes (PTH) vias, providing signal sequencing, ground,...
Printed circuit board flexible / double-sided - TYPE II
Two conductor layers separated by laminated dielectric usually with plated through holes (PTH) vias, providing signal sequencing, ground, signal matching and high-density interconnect.
Benefits of Double-Sided Flexible Printed Circuits:
Wider circuit design parameters when compared to single-sided flex
Access to circuit traces from both sides of the flex configuration
Reduced assembly costs due to minimized interconnect errors
Dynamic flexing ability
Neater/cleaner system appearance
Reduced packaging dimensions
Benefits of Double-Sided Flexible Printed Circuits:
Wider circuit design parameters when compared to single-sided flex
Access to circuit traces from both sides of the flex configuration
Reduced assembly costs due to minimized interconnect errors
Dynamic flexing ability
Neater/cleaner system appearance
Reduced packaging dimensions
Printed circuit board flexible / multilayer - TYPE III
TYPE III: Multilayer Flex
Three or more conductor layers separated by laminated dielectric usually with plated through holes (PTH) vias.,...
Three or more conductor layers separated by laminated dielectric usually with plated through holes (PTH) vias.,...
Printed circuit board flexible / multilayer - TYPE III
TYPE III: Multilayer Flex
Three or more conductor layers separated by laminated dielectric usually with plated through holes (PTH) vias., providing combinations of signal, power and ground in a high-density interconnect configuration. This three-dimensional package provides the complete electronic interconnect.
Benefits of Multilayer Flexible Printed Circuits:
Allows for larger number of signals to be routed in the circuit
Provides superior signal integrity
Offers localized areas where stiffeners and components can be added
Three or more conductor layers separated by laminated dielectric usually with plated through holes (PTH) vias., providing combinations of signal, power and ground in a high-density interconnect configuration. This three-dimensional package provides the complete electronic interconnect.
Benefits of Multilayer Flexible Printed Circuits:
Allows for larger number of signals to be routed in the circuit
Provides superior signal integrity
Offers localized areas where stiffeners and components can be added
Printed circuit board flexible - TYPE IV
Three or more conductor layers separated by laminated dielectric, usually with plated through-holes (PTH) vias. A versatile combination...
Printed circuit board flexible - TYPE IV
Three or more conductor layers separated by laminated dielectric, usually with plated through-holes (PTH) vias. A versatile combination of both rigid and flexible technology to provide complete three dimensional capabilities for both commercial and military applications.
Benefits of Rigid, Flexible, Printed Circuits:
Combines true rigid board with a flexible circuit
Allows for placement of fine-pitch components and small components
Meets double-sided assembly requirements
Benefits of Rigid, Flexible, Printed Circuits:
Combines true rigid board with a flexible circuit
Allows for placement of fine-pitch components and small components
Meets double-sided assembly requirements
Printed circuit board flexible - Sculptured®
These circuits are designed to mate with connectors that have solder cup terminations or plug directly into sockets of a female connector. They can take the place of the traditional "jumper cable"...
Printed circuit board flexible - Sculptured®
These circuits are designed to mate with connectors that have solder cup terminations or plug directly into sockets of a female connector. They can take the place of the traditional "jumper cable"...
Printed circuit board thermally-conductive substrate PCB
Thermal Clad Insulated Metal Substrate (IMS®) was developed by Bergquist as a thermal management solution for today's higher watt-density surface mount applications where heat issues are a major concern.
Thermal Clad substrates minimize thermal impedance and conduct heat more effectively and efficiently than standard...
Thermal Clad substrates minimize thermal impedance and conduct heat more effectively and efficiently than standard...
Printed circuit board thermally-conductive substrate PCB
Thermal Clad Insulated Metal Substrate (IMS®) was developed by Bergquist as a thermal management solution for today's higher watt-density surface mount applications where heat issues are a major concern.
Thermal Clad substrates minimize thermal impedance and conduct heat more effectively and efficiently than standard...
Thermal Clad substrates minimize thermal impedance and conduct heat more effectively and efficiently than standard...