Printed circuit boards

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Fujikura

Printed circuit board flexible / multilayer

The multi-layer FPC has three (3) or more conductive layers. Integrated high-density packaging with multiple conductive layers allows for circuit routing used with high pin-count component...

Printed circuit board flexible / multilayer

The multi-layer FPC has three (3) or more conductive layers. Integrated high-density packaging with multiple conductive layers allows for circuit routing used with high pin-count component assemblies.

Features
High reliability and space-saving is achieved by eliminating coupling parts such as connectors.
Various types of FPCs are possible through our innovative construction technique of partial multi-layering to utilize the most of FPC properties (flexibility).
We are now developing a unique APIC (All Polyimide IVH Colaminated) multi-layer FPC for high-density applications.

Applications
Electrical wiring for DSCs, DVCs and laptop PCs
Mobile phones
Camera modules, etc.

Printed circuit board double-sided / flexible

The double-sided FPC has two conductive layers that are electrically connected. This provides higher design...

Printed circuit board double-sided / flexible

The double-sided FPC has two conductive layers that are electrically connected. This provides higher design flexibility compared to single-sided FPCs.

Applications
Typically utilized for high-density wiring that cannot use single-sided FPCs.
Electrical wiring for DSCs, DVCs and laptop PCs
Plasma displays, LCD modules
Highly flexible parts (i.e., hinge part of mobile phones, etc.)
MINCO

Printed circuit board flexible - 0.008 in | HDI

High Density Interconnect (HDI) flexible circuits offer increased design, layout and construction options over typical flexible circuits. Each High Density Interconnect incorporates microvias...

Printed circuit board flexible - 0.008 in | HDI

High Density Interconnect (HDI) flexible circuits offer increased design, layout and construction options over typical flexible circuits. Each High Density Interconnect incorporates microvias and fine features to achieve highly dense flex circuitry, smaller form factor and increased functionality. This technology offers better electrical performance, access to advanced integrated circuit (IC) package use and improved reliability through the use of microvias and thinner materials.

Mincos state-of-the-art facility and equipment can provide you with unmatched HDI features and performance, and our IPC-certified designers can assist you with improving reliability and help make your designs easier to buildwithout sacrificing performance.
Tech-Etch

Printed circuit board flexible / double-sided

Tech-Etch manufactures high reliability flexible printed circuits on polyimide substrates using advanced manufacturing processes. We specialize in single and double-sided circuits, as well...

Printed circuit board flexible / double-sided

Tech-Etch manufactures high reliability flexible printed circuits on polyimide substrates using advanced manufacturing processes. We specialize in single and double-sided circuits, as well as multi-layer and flex circuit assemblies. The flex circuits are built to the exacting specifications of our customers, meeting the most demanding of applications in the ultrasound probe, medical device, semiconductor test & manufacturing equipment, industrial equipment, and aerospace markets. With all engineering, tooling, and manufacturing operations housed in our state of the art 150,000 sq. ft. facility in Plymouth, MA, Tech-Etch is the perfect choice for all of your flex circuit needs from quick turn and prototype through production volumes.
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