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Printed circuit board thermally-conductive substrate PCB - Tlam IMPCB LLD04

Thermally Conductive PCB Substrate

Ultra-Bright Led Insulated Metal Printed Circuit Board Material

Tlam IMPCB LLD is a copper circuit layer and aluminum or copper base plate bonded together with LLD dielectric. Tlam IMPCB LLD is processed through standard FR4 print and etch operations.



LLD is designed for bright and ultra-bright LED module applications. LLD products have 6-8 times better thermal conductivity compared to FR4, key to keeping components cool. LLD boards are processed through standard pick-and-place SMT and manual wire bond operations.



Standard constructions are made with 1 or 2 ounce copper and 0.040 (1) or 0.062 (1.6) inch (mm) thick aluminum.

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