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Printed circuit board flexible / multilayer
The multi-layer FPC has three (3) or more conductive layers. Integrated high-density packaging with multiple conductive layers allows for circuit routing used with high pin-count component assemblies.Features
High reliability and space-saving is achieved by eliminating coupling parts such as connectors.
Various types of FPCs are possible through our innovative construction technique of partial multi-layering to utilize the most of FPC properties (flexibility).
We are now developing a unique APIC (All Polyimide IVH Colaminated) multi-layer FPC for high-density applications.
Applications
Electrical wiring for DSCs, DVCs and laptop PCs
Mobile phones
Camera modules, etc.