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Piovan

Granulator - 200 mm | RN 20

RN 20 Series low speed granulators, characterised by a 200 mm diameter with multiple staggered blades and 300 and 450 mm length. A version with open rotor for the recovery of blow moulded sprues is also...

Granulator - 200 mm | RN 20

RN 20 Series low speed granulators, characterised by a 200 mm diameter with multiple staggered blades and 300 and 450 mm length. A version with open rotor for the recovery of blow moulded sprues is also available.

The most distinctive feature of the RN 2030/2045 is its rugged design, a characteristic uncommon in similar models. The granulation chamber is made of thick steel plates, machined on CNC centres, bolted together, and the blade supports are of forged steel. The continuous cutting action guarantees high performance and the blades can be easily removed for sharpening without any subsequent need of mechanical adjustment after their re-installation. Moreover, two lateral discs running with the rotor prevent friction and damage of the material to be ground against the chamber walls.
BE Semiconductor Industries

Molding encapsulation die machine - 9 kVA, max. 2272 x 1490 x 1976 mm | Fico AMS-W

The Fico AMS-W, which is manufactured by Besi, is a MAP molding system that has been...

Molding encapsulation die machine - 9 kVA, max. 2272 x 1490 x 1976 mm | Fico AMS-W

The Fico AMS-W, which is manufactured by Besi, is a MAP molding system that has been developed to provide effective, and reliable quality performance. It is specifically used for single sided packaging of products such as BOC, BGA, QFN, and BGA-MAP. Its compact, and versatile design has a maximum throughput of ca. 250 Lf/h.

Molding encapsulation die machine - max. 3145 x 1652 x 1976 mm | Fico AMS-LM

The Fico AMS-LM series of molding solutions from BESI, has pioneered a big molding system for substrates...

Molding encapsulation die machine - max. 3145 x 1652 x 1976 mm | Fico AMS-LM

The Fico AMS-LM series of molding solutions from BESI, has pioneered a big molding system for substrates that is in line with the existing need for larger substrates. These can deal with 102 x 280 mm substrates, as well as with all the current single sided packages. The large substrates provide highly used boards, which, together with its high productivity, ensures improved performance and yield.

Molding encapsulation die machine - 7.5 kVA, max. 1210 x 1020 x 2012 mm | Fico MMS-LM

The Fico MMS-LM is a molding system manufactured by Besi. This equipment is suitable for single sided products found in MAP like BGA and QFN. New products can...

Molding encapsulation die machine - 7.5 kVA, max. 1210 x 1020 x 2012 mm | Fico MMS-LM

The Fico MMS-LM is a molding system manufactured by Besi. This equipment is suitable for single sided products found in MAP like BGA and QFN. New products can be innovated and enhanced prior to large scale production through the utilization of original molds. This equipment offers flexibility as it can be used for production in small batches. It can also be used as offline cleaner of Fico AMS-LM molds.

This system delivers a wide range of opportunities to develop new products through the utilization of test molds. Furthermore, Fico MMS-LM can be used with V-pin molds to enable optimum control of the cavity vacuum.
Starlinger & Co. Ges.M.B.H.

Automatic plastic bag making machine - tubeTEC

The tubeTEC series of Tubing lines from STARLINGER offers tubing...

Automatic plastic bag making machine - tubeTEC

The tubeTEC series of Tubing lines from STARLINGER offers tubing processes with overall sack printing as one of its benefits. It provides operations for sewn valve sacks, CPP sacks, and coated sacks that has no overcoating edges.
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