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• Molding encapsulation die machine - 9 kVA, max. 2272 x 1490 x 1976 mm | Fico AMS-W

Molding encapsulation die machine - 9 kVA, max. 2272 x 1490 x 1976 mm | Fico AMS-W

The Fico AMS-W, which is manufactured by Besi, is a MAP molding system that has been developed to provide effective, and reliable quality performance. It is specifically used for single sided packaging of products such as BOC, BGA, QFN, and BGA-MAP. Its compact, and versatile design has a maximum throughput of ca. 250 Lf/h.

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