Molding encapsulation die machine - 7.5 kVA, max. 1210 x 1020 x 2012 mm | Fico MMS-LM

Molding encapsulation die machine - 7.5 kVA, max. 1210 x 1020 x 2012 mm | Fico MMS-LM
BE Semiconductor Industries The Fico MMS-LM is a molding system manufactured by Besi. This equipment is suitable for single sided products found in MAP like BGA and QFN. New products can be innovated and enhanced prior to large scale production through the utilization of original molds. This equipment offers flexibility as it can be used for production in small batches. It can also be used as offline cleaner of Fico AMS-LM molds.

This system delivers a wide range of opportunities to develop new products through the utilization of test molds. Furthermore, Fico MMS-LM can be used with V-pin molds to enable optimum control of the cavity vacuum.

Any questions?

Please ask our sales team!

Ask question

Other products: