Molding encapsulation die machine - max. 3145 x 1652 x 1976 mm | Fico AMS-LM

Molding encapsulation die machine - max. 3145 x 1652 x 1976 mm | Fico AMS-LM
BE Semiconductor Industries The Fico AMS-LM series of molding solutions from BESI, has pioneered a big molding system for substrates that is in line with the existing need for larger substrates. These can deal with 102 x 280 mm substrates, as well as with all the current single sided packages. The large substrates provide highly used boards, which, together with its high productivity, ensures improved performance and yield.

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