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Electrical insulating panel / flexible / multilayer
Flexible multi-layer insulations from KREMPEL are produced by adhesive- bonding plastic films with presspaper, non-wovens, fabric or plastic-paper materials. Multi-layer insulations are normally produced as three-layer combinations whereby the...
Electrical insulating panel / flexible / multilayer
Flexible multi-layer insulations from KREMPEL are produced by adhesive- bonding plastic films with presspaper, non-wovens, fabric or plastic-paper materials. Multi-layer insulations are normally produced as three-layer combinations whereby the plastic film is in the middle. Depending on the material combination, very specific ranges of values can be designed for the operating temperature, ductility, tensile strength, elongation, breakdown voltage, capacity for impregnation and the rigidity of the multi-layer. Special, UL-recognised grades are also available.
The combination of plastic film and fibrous material gives both technical as well as economic advantages. The plastic film guarantees the outstanding electrical and mechanical properties whereas the fibrous material ensure good impregnation and protect the film. Flexible multi-layer insulations can be cut, folded, embossed and to a certain extent, can be cold and hot-shaped as well.
The combination of plastic film and fibrous material gives both technical as well as economic advantages. The plastic film guarantees the outstanding electrical and mechanical properties whereas the fibrous material ensure good impregnation and protect the film. Flexible multi-layer insulations can be cut, folded, embossed and to a certain extent, can be cold and hot-shaped as well.
Thermally conductive gap filler - Tflex™ series
Laird Technologies thermal gap filler pads deliver engineers and designers the most dimensional tolerance by conforming to surface irregularities and replacing air with a much higher thermal conductivity material; increasing the heat transfer and allowing the component to run cooler. Extreme compliancy reduces component stress while higher...
Thermally conductive gap filler - Tflex™ series
Laird Technologies thermal gap filler pads deliver engineers and designers the most dimensional tolerance by conforming to surface irregularities and replacing air with a much higher thermal conductivity material; increasing the heat transfer and allowing the component to run cooler. Extreme compliancy reduces component stress while higher thermal conductivity provides thermal performance required for next generation designs that continue to pack more power into smaller spaces. These thermal gap filler pad products are used in many applications such as notebook computers, mass storage devices, and audio and video components.
The full thermal gap filler pad product offering encompasses the Tpli™, Tflex™, and Tputty™ lines that provide exceptional combination of high thermal conductivity and compliancy that generate unmatched thermal resistances in a gap filling interface material.
General attributes include highly conformable gap fillers designed to provide excellent thermal performance while remaining cost-effective. The soft interface pads conform well with minimal pressure, resulting in little or no stress on mating parts. Naturally tacky and requiring no adhesive coating to inhibit thermal performance, they are very soft and free standing that are more conformable than most gap fillers.
The full thermal gap filler pad product offering encompasses the Tpli™, Tflex™, and Tputty™ lines that provide exceptional combination of high thermal conductivity and compliancy that generate unmatched thermal resistances in a gap filling interface material.
General attributes include highly conformable gap fillers designed to provide excellent thermal performance while remaining cost-effective. The soft interface pads conform well with minimal pressure, resulting in little or no stress on mating parts. Naturally tacky and requiring no adhesive coating to inhibit thermal performance, they are very soft and free standing that are more conformable than most gap fillers.
Electrically insulating and thermally conductive material - Tgard series
Laird Technologies offers a line of thermally conductive electrically insulating materials that are designed to solve over-heating issues for today's power component assemblies.
The...
The...
Electrically insulating and thermally conductive material - Tgard series
Laird Technologies offers a line of thermally conductive electrically insulating materials that are designed to solve over-heating issues for today's power component assemblies.
The robust Tgard™ product line is a film-based material that is designed to resist cut-through in screw mounting applications. Tgard™ products provide a more consistent breakdown voltage over other insulation constructions with soft conformal coating on the film core that provides an excellent mating surface for low pressure clip mounting applications.
The Tgard™ insulator products are available in a diverse range of thermal performances to suit any application.
The robust Tgard™ product line is a film-based material that is designed to resist cut-through in screw mounting applications. Tgard™ products provide a more consistent breakdown voltage over other insulation constructions with soft conformal coating on the film core that provides an excellent mating surface for low pressure clip mounting applications.
The Tgard™ insulator products are available in a diverse range of thermal performances to suit any application.
Thermally conductive material - Tgon 800
Electrically and Thermally Conductive Interface Pad
High-Performance, Cost Effective Thermal Interface Material
Used where electrical isolation is not required, Tgon™ 800...
High-Performance, Cost Effective Thermal Interface Material
Used where electrical isolation is not required, Tgon™ 800...
Thermally conductive material - Tgon 800
Electrically and Thermally Conductive Interface Pad
High-Performance, Cost Effective Thermal Interface Material
Used where electrical isolation is not required, Tgon™ 800 is ideal for where electrical contact and thermal transfer are desired.
Its unique grain-oriented, plate-like structure provides a high thermal conductivity of 240 W/mK in the XY plane and 5 W/mK through the z-axis.. Tgon 800 can be supplied in 12” x 18” (305mm x 457mm) or 18” x 24” (457mm x 610mm) sheets, rolls or die-cut to specific configurations.
It is also available with proprietary pressure sensitive adhesive on one side. This adhesive
coating is the thinnest available, minimizing any impact on thermal performance.
High-Performance, Cost Effective Thermal Interface Material
Used where electrical isolation is not required, Tgon™ 800 is ideal for where electrical contact and thermal transfer are desired.
Its unique grain-oriented, plate-like structure provides a high thermal conductivity of 240 W/mK in the XY plane and 5 W/mK through the z-axis.. Tgon 800 can be supplied in 12” x 18” (305mm x 457mm) or 18” x 24” (457mm x 610mm) sheets, rolls or die-cut to specific configurations.
It is also available with proprietary pressure sensitive adhesive on one side. This adhesive
coating is the thinnest available, minimizing any impact on thermal performance.
Liquid-cooled heat sink - WL Series
As engineers, you understand the critical importance of thermal management systems. You also understand that different applications have different needs, usually requiring custom-designed solutions. But you also know that those solutions need to be reliable, sustainable and deliverable on time and on budget.
By working with Laird, you are engaging with a global trusted partner...
By working with Laird, you are engaging with a global trusted partner...
Liquid-cooled heat sink - WL Series
As engineers, you understand the critical importance of thermal management systems. You also understand that different applications have different needs, usually requiring custom-designed solutions. But you also know that those solutions need to be reliable, sustainable and deliverable on time and on budget.
By working with Laird, you are engaging with a global trusted partner with proven experience and expertise in creating innovative, active solutions to the most complex thermal management issues. With the broadest product line that comprises liquid cooling systems to recirculating chillers, thermoelectric assemblies to thin film thermoelectric modules, we have the scale, the production capabilities and the appetite to deliver what you need, when you need it, and at a price you can afford.As engineers, you understand the critical importance of thermal management systems. You also understand that different applications have different needs, usually requiring custom-designed solutions. But you also know that those solutions need to be reliable, sustainable and deliverable on time and on budget.
By working with Laird, you are engaging with a global trusted partner with proven experience and expertise in creating innovative, active solutions to the most complex thermal management issues. With the broadest product line that comprises liquid cooling systems to recirculating chillers, thermoelectric assemblies to thin film thermoelectric modules, we have the scale, the production capabilities and the appetite to deliver what you need, when you need it, and at a price you can afford.
By working with Laird, you are engaging with a global trusted partner with proven experience and expertise in creating innovative, active solutions to the most complex thermal management issues. With the broadest product line that comprises liquid cooling systems to recirculating chillers, thermoelectric assemblies to thin film thermoelectric modules, we have the scale, the production capabilities and the appetite to deliver what you need, when you need it, and at a price you can afford.As engineers, you understand the critical importance of thermal management systems. You also understand that different applications have different needs, usually requiring custom-designed solutions. But you also know that those solutions need to be reliable, sustainable and deliverable on time and on budget.
By working with Laird, you are engaging with a global trusted partner with proven experience and expertise in creating innovative, active solutions to the most complex thermal management issues. With the broadest product line that comprises liquid cooling systems to recirculating chillers, thermoelectric assemblies to thin film thermoelectric modules, we have the scale, the production capabilities and the appetite to deliver what you need, when you need it, and at a price you can afford.
Thermal interface material - Gad series
It provides an effective thermal interface between heat sinks and electronic devices where uneven surface...
Thermal interface material - Gad series
It provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. Gap Pad provides:
Elimination of air gaps to reduce thermal resistance
High conformability to reduce interfacial resistance
Low-stress vibration dampening
Compatible with automated dispensing equipment
Elimination of air gaps to reduce thermal resistance
High conformability to reduce interfacial resistance
Low-stress vibration dampening
Compatible with automated dispensing equipment
Electrically insulating and thermally conductive material - Bond series
The Bond-Ply family of materials are thermally conductive and electrically isolating. Bond-Ply is...
Electrically insulating and thermally conductive material - Bond series
The Bond-Ply family of materials are thermally conductive and electrically isolating. Bond-Ply is available in a PSA or laminating format. Bond-Ply provides for the decoupling of bonded materials with mismatched thermal coefficients of expansion. Bond-Ply provides:
A replacement to heat cure adhesives
A replacement to screw mounting
A replacement to clip mounting
A replacement to heat cure adhesives
A replacement to screw mounting
A replacement to clip mounting
Phase change material - Hi-flow, TIC series
Excellent replacement for grease as a thermal interface between CPU or power devices and a heat sink. Hi-Flow materials change from a solid...
Phase change material - Hi-flow, TIC series
Excellent replacement for grease as a thermal interface between CPU or power devices and a heat sink. Hi-Flow materials change from a solid at specific temperatures and flow to assure total wet-out of the interface without overflow. Hi-Flow provides:
A replacement to grease, saving time and money without sacrificing thermal performance
No mess- thixotropic characteristics keep it from flowing out of the interface
Easier handling- not tacky at room temperature
Simplified application process with many tabbed configurations
A replacement to grease, saving time and money without sacrificing thermal performance
No mess- thixotropic characteristics keep it from flowing out of the interface
Easier handling- not tacky at room temperature
Simplified application process with many tabbed configurations