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Thermally conductive gap filler - Tflex™ series
Laird Technologies thermal gap filler pads deliver engineers and designers the most dimensional tolerance by conforming to surface irregularities and replacing air with a much higher thermal conductivity material; increasing the heat transfer and allowing the component to run cooler. Extreme compliancy reduces component stress while higher thermal conductivity provides thermal performance required for next generation designs that continue to pack more power into smaller spaces. These thermal gap filler pad products are used in many applications such as notebook computers, mass storage devices, and audio and video components.The full thermal gap filler pad product offering encompasses the Tpli™, Tflex™, and Tputty™ lines that provide exceptional combination of high thermal conductivity and compliancy that generate unmatched thermal resistances in a gap filling interface material.
General attributes include highly conformable gap fillers designed to provide excellent thermal performance while remaining cost-effective. The soft interface pads conform well with minimal pressure, resulting in little or no stress on mating parts. Naturally tacky and requiring no adhesive coating to inhibit thermal performance, they are very soft and free standing that are more conformable than most gap fillers.