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Plasma surface preparation machines
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Plasma source CVD / for surface treatment / PVD
RF Atom Source for atomic oxygen and atomic nitrogen
Minimized power losses due to optimized design
Discharge zone is manufactured from high-quality materials ensuring a minimal contamination of the beam
Zero-ion current configuration as standard
The growth of high-quality...
Minimized power losses due to optimized design
Discharge zone is manufactured from high-quality materials ensuring a minimal contamination of the beam
Zero-ion current configuration as standard
The growth of high-quality...
Plasma source CVD / for surface treatment / PVD
RF Atom Source for atomic oxygen and atomic nitrogen
Minimized power losses due to optimized design
Discharge zone is manufactured from high-quality materials ensuring a minimal contamination of the beam
Zero-ion current configuration as standard
The growth of high-quality compound materials ideally require neutral, atomic species. Whereas molecular gases such as oxygen or nitrogen have shown to orders of magnitude less reactive than if dissociated into atomic form.
Therefore oxide formation using molecular oxygen typically requires highly elevated temperatures and/or extended oxidation periods, while molecular nitrogen shows almost no reactivity for many materials.
Thus the dissociated species are increasing the reactivity by many orders of magnitude and therefore allows oxides or nitrides to be grown at low pressure and at reasonable substrate temperatures.
However, ionic species generated in plasma processes tend to be energetic and possibly create point defects. On the other hand, atomic species carry negligible kinetic energy and therefore allow rapid film growth without generating defects.
Minimized power losses due to optimized design
Discharge zone is manufactured from high-quality materials ensuring a minimal contamination of the beam
Zero-ion current configuration as standard
The growth of high-quality compound materials ideally require neutral, atomic species. Whereas molecular gases such as oxygen or nitrogen have shown to orders of magnitude less reactive than if dissociated into atomic form.
Therefore oxide formation using molecular oxygen typically requires highly elevated temperatures and/or extended oxidation periods, while molecular nitrogen shows almost no reactivity for many materials.
Thus the dissociated species are increasing the reactivity by many orders of magnitude and therefore allows oxides or nitrides to be grown at low pressure and at reasonable substrate temperatures.
However, ionic species generated in plasma processes tend to be energetic and possibly create point defects. On the other hand, atomic species carry negligible kinetic energy and therefore allow rapid film growth without generating defects.
Surface treatment machine plasma - Plasma-Jet®
Corotec Corporation has introduced a new line of Plasma-Jet® surface treatment systems for 3D parts. These new systems feature a smaller and more compact discharge head design 50% smaller than the standard design which enables installation and operation in space-restricted applications.
The...
The...
Surface treatment machine plasma - Plasma-Jet®
Corotec Corporation has introduced a new line of Plasma-Jet® surface treatment systems for 3D parts. These new systems feature a smaller and more compact discharge head design 50% smaller than the standard design which enables installation and operation in space-restricted applications.
The...
The...
Surface treatment machine plasma - PJ series
For improved bonding of inks, adhesives, and coatings, our Plasma-Jet® treats plastic and metal products with greater application flexibility, surface coverage, and speed.
We have advanced our surface treating technology with new...
We have advanced our surface treating technology with new...
Surface treatment machine plasma - PJ series
For improved bonding of inks, adhesives, and coatings, our Plasma-Jet® treats plastic and metal products with greater application flexibility, surface coverage, and speed.
We have advanced our surface treating technology with new...
We have advanced our surface treating technology with new...
Surface treatment machine plasma - Pulsed-Plasma™
The NEW Corotec Pulsed-Plasma™ treating system is designed specifically for treating hard-to-reach surfaces of medical and other devices, such as the insides of the plastic hubs that hold hypodermic needles and dispensing nozzles, to allow superior adhesion of the hub to the nozzle.
The Pulsed-Plasma™ system can treat a variety of parts which would be difficult or impossible...
The Pulsed-Plasma™ system can treat a variety of parts which would be difficult or impossible...
Surface treatment machine plasma - Pulsed-Plasma™
The NEW Corotec Pulsed-Plasma™ treating system is designed specifically for treating hard-to-reach surfaces of medical and other devices, such as the insides of the plastic hubs that hold hypodermic needles and dispensing nozzles, to allow superior adhesion of the hub to the nozzle.
The Pulsed-Plasma™ system can treat a variety of parts which would be difficult or impossible...
The Pulsed-Plasma™ system can treat a variety of parts which would be difficult or impossible...
Surface treatment machine plasma / laboratory - 200 x 200 mm, 6 l
In industry, etching, also known as chemical milling, is the process of using acids, bases or other chemicals to dissolve unwanted materials such as metals, semiconductor materials or glass. Selective...
Surface treatment machine plasma / laboratory - 200 x 200 mm, 6 l
In industry, etching, also known as chemical milling, is the process of using acids, bases or other chemicals to dissolve unwanted materials such as metals, semiconductor materials or glass. Selective attack by the chemical reagent on different areas of the workpiece surfaces is controlled by removable layers of material called masking or by partial immersion in the reagent. It has applications in the printed circuit board and semiconductor fabrication industries. It is also used in the aerospace industry to remove shallow layers of material from large aircraft components, missile skin panels, and extruded parts for airframes.
At Europlasma we do not use acids or chemicals, only natural gasses, brought to their plasma state to etch.
This technique is much more environmental friendly.
At Europlasma we do not use acids or chemicals, only natural gasses, brought to their plasma state to etch.
This technique is much more environmental friendly.
Surface treatment machine plasma / laboratory - 300 x 300 x 300 mm, 27 l | CD300 PLC
Our smallest coater is the ideal machine for small production!
It has a 50 L chamber and is our latest addition to our range of Nanofics machines. The one tray has a useful space of 0.09 m.
Plasma is the fourth state of matter. By adding energy matter can be transformed from solid to liquid, from liquid to gas and from gas to plasma. In plasma the molecules are decomposed in neutral...
It has a 50 L chamber and is our latest addition to our range of Nanofics machines. The one tray has a useful space of 0.09 m.
Plasma is the fourth state of matter. By adding energy matter can be transformed from solid to liquid, from liquid to gas and from gas to plasma. In plasma the molecules are decomposed in neutral...
Surface treatment machine plasma / laboratory - 300 x 300 x 300 mm, 27 l | CD300 PLC
Our smallest coater is the ideal machine for small production!
It has a 50 L chamber and is our latest addition to our range of Nanofics machines. The one tray has a useful space of 0.09 m.
Plasma is the fourth state of matter. By adding energy matter can be transformed from solid to liquid, from liquid to gas and from gas to plasma. In plasma the molecules are decomposed in neutral and charged particles that will interact with the surface of the material. In low pressure plasma technology a stable and effective plasma is created by an electromagnetic discharge of a gas at low pressure and at low temperature.
In recent years low pressure plasma technology has been improved to achieve polymerization of monomers on materials, depositing real nanocoatings on the surface, and adding new and permanent functionalities to the material. Innovative plasma processes allow to deposit coatings with high levels of hydrophobicity and/or oleophobicity for use in the effective corrosion protection of electronics, from bare components to complete, assembled electronic hand held devices. This improves the lifetime and the reliability of the device to a large extend.
The use of low pressure plasma for the application of coatings on electronic components and hand held devices becomes more widespread because it is a dry and clean technology. Electronic component producers, hand held device producers and also the retail market adopt plasma coating to improve the quality of their products. At the same time it helps these companies to save costs because of a lower consumption of energy and chemicals.
It has a 50 L chamber and is our latest addition to our range of Nanofics machines. The one tray has a useful space of 0.09 m.
Plasma is the fourth state of matter. By adding energy matter can be transformed from solid to liquid, from liquid to gas and from gas to plasma. In plasma the molecules are decomposed in neutral and charged particles that will interact with the surface of the material. In low pressure plasma technology a stable and effective plasma is created by an electromagnetic discharge of a gas at low pressure and at low temperature.
In recent years low pressure plasma technology has been improved to achieve polymerization of monomers on materials, depositing real nanocoatings on the surface, and adding new and permanent functionalities to the material. Innovative plasma processes allow to deposit coatings with high levels of hydrophobicity and/or oleophobicity for use in the effective corrosion protection of electronics, from bare components to complete, assembled electronic hand held devices. This improves the lifetime and the reliability of the device to a large extend.
The use of low pressure plasma for the application of coatings on electronic components and hand held devices becomes more widespread because it is a dry and clean technology. Electronic component producers, hand held device producers and also the retail market adopt plasma coating to improve the quality of their products. At the same time it helps these companies to save costs because of a lower consumption of energy and chemicals.
Surface treatment machine plasma / laboratory - 400 x 400 x 400 mm, 64 l | CD400 PLC
64L chamber, for etching small items.
4 horizontal trays for bulk production .
The parts are loaded in the trays, the trays are loaded into the chamber. The chamber...
4 horizontal trays for bulk production .
The parts are loaded in the trays, the trays are loaded into the chamber. The chamber...
Surface treatment machine plasma / laboratory - 400 x 400 x 400 mm, 64 l | CD400 PLC
64L chamber, for etching small items.
4 horizontal trays for bulk production .
The parts are loaded in the trays, the trays are loaded into the chamber. The chamber door is closed. The chamber is pumped down to a vacuum of approximately 100 mTorr. Process gas is then introduced into the chamber. After gas stabilisation the generator is switched on. The plasma treatment starts. After treatment the generator and the gasflow are shut off. The vacuum valve between the pump and the chamber is closed. The chamber is vented and the chamber door opened. The trays with treated parts are moved from the loading rack, out of the chamber. The parts are removed from the trays.
4 horizontal trays for bulk production .
The parts are loaded in the trays, the trays are loaded into the chamber. The chamber door is closed. The chamber is pumped down to a vacuum of approximately 100 mTorr. Process gas is then introduced into the chamber. After gas stabilisation the generator is switched on. The plasma treatment starts. After treatment the generator and the gasflow are shut off. The vacuum valve between the pump and the chamber is closed. The chamber is vented and the chamber door opened. The trays with treated parts are moved from the loading rack, out of the chamber. The parts are removed from the trays.
Surface treatment machine plasma - 600 x 600 x 600 mm, 216 l | CD600 PLC
The CD600 is especially designed for cleaning, desmearing and etching PCB board (both rigid and flexible) in its vertical slots.
In industry, etching, also known as chemical milling, is the process of using acids, bases or other chemicals...
In industry, etching, also known as chemical milling, is the process of using acids, bases or other chemicals...
Surface treatment machine plasma - 600 x 600 x 600 mm, 216 l | CD600 PLC
The CD600 is especially designed for cleaning, desmearing and etching PCB board (both rigid and flexible) in its vertical slots.
In industry, etching, also known as chemical milling, is the process of using acids, bases or other chemicals to dissolve unwanted materials such as metals, semiconductor materials or glass. Selective attack by the chemical reagent on different areas of the workpiece surfaces is controlled by removable layers of material called masking or by partial immersion in the reagent. It has applications in the printed circuit board and semiconductor fabrication industries. It is also used in the aerospace industry to remove shallow layers of material from large aircraft components, missile skin panels, and extruded parts for airframes.
At Europlasma we do not use acids or chemicals, only natural gasses, brought to their plasma state to etch.
This technique is much more environmental friendly.
In industry, etching, also known as chemical milling, is the process of using acids, bases or other chemicals to dissolve unwanted materials such as metals, semiconductor materials or glass. Selective attack by the chemical reagent on different areas of the workpiece surfaces is controlled by removable layers of material called masking or by partial immersion in the reagent. It has applications in the printed circuit board and semiconductor fabrication industries. It is also used in the aerospace industry to remove shallow layers of material from large aircraft components, missile skin panels, and extruded parts for airframes.
At Europlasma we do not use acids or chemicals, only natural gasses, brought to their plasma state to etch.
This technique is much more environmental friendly.
Surface treatment machine plasma - 1000 x 700 x 700 mm, 490 l | CD1000 PLC
Roll cassette design for etching PCB strips.
In industry, etching, also known as chemical milling, is the process of using acids, bases or other chemicals to dissolve unwanted materials such as metals, semiconductor...
In industry, etching, also known as chemical milling, is the process of using acids, bases or other chemicals to dissolve unwanted materials such as metals, semiconductor...
Surface treatment machine plasma - 1000 x 700 x 700 mm, 490 l | CD1000 PLC
Roll cassette design for etching PCB strips.
In industry, etching, also known as chemical milling, is the process of using acids, bases or other chemicals to dissolve unwanted materials such as metals, semiconductor materials or glass. Selective attack by the chemical reagent on different areas of the workpiece surfaces is controlled by removable layers of material called masking or by partial immersion in the reagent. It has applications in the printed circuit board and semiconductor fabrication industries. It is also used in the aerospace industry to remove shallow layers of material from large aircraft components, missile skin panels, and extruded parts for airframes.
At Europlasma we do not use acids or chemicals, only natural gasses, brought to their plasma state to etch.
This technique is much more environmental friendly
In industry, etching, also known as chemical milling, is the process of using acids, bases or other chemicals to dissolve unwanted materials such as metals, semiconductor materials or glass. Selective attack by the chemical reagent on different areas of the workpiece surfaces is controlled by removable layers of material called masking or by partial immersion in the reagent. It has applications in the printed circuit board and semiconductor fabrication industries. It is also used in the aerospace industry to remove shallow layers of material from large aircraft components, missile skin panels, and extruded parts for airframes.
At Europlasma we do not use acids or chemicals, only natural gasses, brought to their plasma state to etch.
This technique is much more environmental friendly