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Backplane connector / high density - 12.5 Gbps | Z-PACK TinMan series
This revolutionary Z-PACK TinMan Backplane Connector family is a cost-effective solution designed for customers. It is suitable for applications needing a high density and high performance backplane interconnect system. It follows proven industry backplane convention by offering right-angle protection receptacle for use in daughter cards. This permits field reparability at either the module or single pin levels. The Ground contacts combined with contact lead frame arrangements enable the Z-PACK TinMan Connector to attain low crosstalk and high through-put performance levels. Reliability is assured with a dual point of contact mating interface and compliant pin interface to the printed circuit board.