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Epoxy adhesive / for electronics - 2 500 psi | EG-2P-3005
The 3M™ Epoxy Bonding Adhesive EG-2P-3005 is a quick setting sealant ideally made for materials with dissimilar surfaces where heat expansion may occur. It is also a flexible epoxy adhesive with a 1:1 mix ratio volume base accelerator. Additionally, the 3M™ adhesive can be applied through bonding, potting and rigidizing.