Epoxy adhesives

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LOCTITE

Silicone adhesive / epoxy / structural - max. +200 °C | Loctite 5940

Loctite 5940 structural bonding - 1K silicone, high elongation

Technical Data

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Silicone adhesive / epoxy / structural - max. +200 °C | Loctite 5940

Loctite 5940 structural bonding - 1K silicone, high elongation

Technical Data

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Epoxy adhesive / structural - max. +100 °C | LOCTITE AA 3038

LOCTITE AA 3038 structural bonding - PO bonder

Your benefits

Very good adhesion to polyolefin...

Epoxy adhesive / structural - max. +100 °C | LOCTITE AA 3038

LOCTITE AA 3038 structural bonding - PO bonder

Your benefits

Very good adhesion to polyolefin...

Epoxy adhesive / structural - max. +120 °C | LOCTITE AA 326

LOCTITE AA 326 structural bonding - magnet bonder

Your benefits

Product for magnet bonding
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Epoxy adhesive / structural - max. +120 °C | LOCTITE AA 326

LOCTITE AA 326 structural bonding - magnet bonder

Your benefits

Product for magnet bonding
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Epoxy adhesive / impact-resistant / structural / general purpose - max. +100 °C | LOCTITE AA 330

LOCTITE AA 330 structural bonding - general purpose

Your benefits

General purpose product
Good impact...

Epoxy adhesive / impact-resistant / structural / general purpose - max. +100 °C | LOCTITE AA 330

LOCTITE AA 330 structural bonding - general purpose

Your benefits

General purpose product
Good impact...
Master Bond

Epoxy adhesive / two-component - -60 - 250 °F | EP31

The Masterbond EP31 is a two-component adhesive system which is integrated with a lap shear advantage rate of up to 4600 psi. It is an epoxy intended...

Epoxy adhesive / two-component - -60 - 250 °F | EP31

The Masterbond EP31 is a two-component adhesive system which is integrated with a lap shear advantage rate of up to 4600 psi. It is an epoxy intended...

Epoxy adhesive / dual-curing - -60 - 350 °F | UV15DC80

Master Bond UV15DC80 is an innovative system because it offers a primary cure utilizing UV light and secondary heat-curing mechanism. This special dual cure epoxy based system solves the...

Epoxy adhesive / dual-curing - -60 - 350 °F | UV15DC80

Master Bond UV15DC80 is an innovative system because it offers a primary cure utilizing UV light and secondary heat-curing mechanism. This special dual cure epoxy based system solves the...

Epoxy adhesive / light-cured - UV18S

UV18S is a new device of Master Bond that can resist chemicals and can be applied for sealing, bonding and coating. Its capability to to withstand chemicals are formed by this product...

Epoxy adhesive / light-cured - UV18S

UV18S is a new device of Master Bond that can resist chemicals and can be applied for sealing, bonding and coating. Its capability to to withstand chemicals are formed by this product...
3M Electronics

Epoxy adhesive / for electronics - 2 500 psi | EG-2P-3005

The 3M™ Epoxy Bonding Adhesive EG-2P-3005 is a quick setting sealant ideally made...

Epoxy adhesive / for electronics - 2 500 psi | EG-2P-3005

The 3M™ Epoxy Bonding Adhesive EG-2P-3005 is a quick setting sealant ideally made for materials with dissimilar surfaces where heat expansion may occur. It is also a flexible epoxy adhesive with a 1:1 mix ratio volume base accelerator. Additionally, the 3M™ adhesive can be applied through bonding, potting and rigidizing.
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