Surface profile measuring machine for semiconductor - HRP-350

Surface profile measuring machine for semiconductor - HRP-350
KLA - TENCOR The HRP-350 is an automatic, sophisticated surface outline topography metrology instrument, comprising maximum resolution/elevated-aspect ratio, stylus-derived surface outlining for most important edge 300mm uses. This surface outline dimension instrument's ultra-superior 20nm stylus tip alternative allows down to 45nm-creation surface outlining at lucrative throughputs for important transistor and interrelate uses. Attributing diamond styli down to a radius of 20nm and a lesser-sound podium for improved outline dimension compassion, the HRP-350 surface outline dimension system presents nanometer-scale stylus skill, which equals Atomic Force Microscopy resolution - with no modeling necessities.

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