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Lapping machine - ø 200 mm | JL-200SCG
The design of the wafer grinding machine is basically inheriting the work principle of a vertical grinding machine. A diamond grinding wheel is fitted to the air floating spindle. The wafer grinding...
Lapping machine - ø 200 mm | JL-200SCG
The design of the wafer grinding machine is basically inheriting the work principle of a vertical grinding machine. A diamond grinding wheel is fitted to the air floating spindle. The wafer grinding...