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Vacuum clamping system - PLANOS
SCHUNK PLANOS matrix plates have been designed for fast and dependable clamping of two-dimensional workpieces with a flat bottom. This results in lesser set-up time for machining centers.
PLANOS...
PLANOS...
Vacuum clamping system - PLANOS
SCHUNK PLANOS matrix plates have been designed for fast and dependable clamping of two-dimensional workpieces with a flat bottom. This results in lesser set-up time for machining centers.
PLANOS even simplifies clamping of components that otherwise pose mechanical difficulty for clamping by holding them accurately with no deformation.
PLANOS has a modular design. For making a connection between the matrix plates and the machine table, it makes use of clamping claws or a fast changeover pallet system. It is possible to combine the matrix plates such that they can match the workpiece geometry, the machining technique, and the horizontal forces requiring absorption. This simplifies handling and also improves flexibility.
PLANOS even simplifies clamping of components that otherwise pose mechanical difficulty for clamping by holding them accurately with no deformation.
PLANOS has a modular design. For making a connection between the matrix plates and the machine table, it makes use of clamping claws or a fast changeover pallet system. It is possible to combine the matrix plates such that they can match the workpiece geometry, the machining technique, and the horizontal forces requiring absorption. This simplifies handling and also improves flexibility.
Ceramic vacuum chuck
CoorsTek's range of ceramic vacuum wafer chucks are made with pure and high quality ceramic that is corrosion resistant to harsh chemicals, and minimizes particle contamination and...
Ceramic vacuum chuck
CoorsTek's range of ceramic vacuum wafer chucks are made with pure and high quality ceramic that is corrosion resistant to harsh chemicals, and minimizes particle contamination and wafer contact. These wafer chucks have a flat design that enhances yield in semiconductor wafer applications. By reducing surface contact, the product also removes any chance of back-side contaminants disrupting the wafer's composition.
All models in the series are characterized by their size capacity of at least 300mm, rigid and light construction, minimized heat expansion and service wear, as well as its mirror polish finish. Furthermore, these features make the product ideal for complex semiconductor processing equipment.
All models in the series are characterized by their size capacity of at least 300mm, rigid and light construction, minimized heat expansion and service wear, as well as its mirror polish finish. Furthermore, these features make the product ideal for complex semiconductor processing equipment.
Vacuum clamping system - VAC SYS series
The VAC Sys SET SE1 is designed for use in milling, sanding, planning, sawing, smoothing, filling, painting, in the workshop or...
Vacuum clamping system - VAC SYS series
The VAC Sys SET SE1 is designed for use in milling, sanding, planning, sawing, smoothing, filling, painting, in the workshop or...