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Fiber laser for cutting and welding applications
Miyachi Unitek has made a process for high quality accurate laser cutting and laser micromachining of metals which are less than 0.5 mm in terms of thickness through a fiber laser marker with high speed XY galvo beam delivery. This process delivers both laser drilling and laser cutting properties and is cost effective too. It is specifically suited for cutting thin and reflective materials such as copper and gold but the typical applications for laser cutting process are semiconductors, solar cells and grids, and micro-electronics. It is also useful for cutting thin sheet metal parts with an underside blur of less than 0.0005" or in cutting prototype lead frames. Furthermore, this laser cutting process does not need assist gas but a if one has to protect the optics to direct particulate matter away from the workpiece, a low pressure flow of gas can be used.