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Epoxy adhesives
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Silicone adhesive / epoxy / structural - max. +200 °C | Loctite 5940
Loctite 5940 structural bonding - 1K silicone, high elongation
Technical Data
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Technical Data
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Silicone adhesive / epoxy / structural - max. +200 °C | Loctite 5940
Loctite 5940 structural bonding - 1K silicone, high elongation
Technical Data
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Technical Data
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Epoxy adhesive / structural - max. +100 °C | LOCTITE AA 3038
LOCTITE AA 3038 structural bonding - PO bonder
Your benefits
Very good adhesion to polyolefin...
Your benefits
Very good adhesion to polyolefin...
Epoxy adhesive / structural - max. +100 °C | LOCTITE AA 3038
LOCTITE AA 3038 structural bonding - PO bonder
Your benefits
Very good adhesion to polyolefin...
Your benefits
Very good adhesion to polyolefin...
Epoxy adhesive / structural - max. +120 °C | LOCTITE AA 326
LOCTITE AA 326 structural bonding - magnet bonder
Your benefits
Product for magnet bonding
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Your benefits
Product for magnet bonding
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Epoxy adhesive / structural - max. +120 °C | LOCTITE AA 326
LOCTITE AA 326 structural bonding - magnet bonder
Your benefits
Product for magnet bonding
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Your benefits
Product for magnet bonding
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Epoxy adhesive / impact-resistant / structural / general purpose - max. +100 °C | LOCTITE AA 330
LOCTITE AA 330 structural bonding - general purpose
Your benefits
General purpose product
Good impact...
Your benefits
General purpose product
Good impact...
Epoxy adhesive / impact-resistant / structural / general purpose - max. +100 °C | LOCTITE AA 330
LOCTITE AA 330 structural bonding - general purpose
Your benefits
General purpose product
Good impact...
Your benefits
General purpose product
Good impact...
Epoxy adhesive / two-component - -60 - 250 °F | EP31
The Masterbond EP31 is a two-component adhesive system which is integrated with a lap shear advantage rate of up to 4600 psi. It is an epoxy intended...
Epoxy adhesive / two-component - -60 - 250 °F | EP31
The Masterbond EP31 is a two-component adhesive system which is integrated with a lap shear advantage rate of up to 4600 psi. It is an epoxy intended...
Epoxy adhesive / dual-curing - -60 - 350 °F | UV15DC80
Master Bond UV15DC80 is an innovative system because it offers a primary cure utilizing UV light and secondary heat-curing mechanism. This special dual cure epoxy based system solves the...
Epoxy adhesive / dual-curing - -60 - 350 °F | UV15DC80
Master Bond UV15DC80 is an innovative system because it offers a primary cure utilizing UV light and secondary heat-curing mechanism. This special dual cure epoxy based system solves the...
Epoxy adhesive / light-cured - UV18S
UV18S is a new device of Master Bond that can resist chemicals and can be applied for sealing, bonding and coating. Its capability to to withstand chemicals are formed by this product...
Epoxy adhesive / light-cured - UV18S
UV18S is a new device of Master Bond that can resist chemicals and can be applied for sealing, bonding and coating. Its capability to to withstand chemicals are formed by this product...
Epoxy adhesive / for electronics - 2 500 psi | EG-2P-3005
The 3M™ Epoxy Bonding Adhesive EG-2P-3005 is a quick setting sealant ideally made...
Epoxy adhesive / for electronics - 2 500 psi | EG-2P-3005
The 3M™ Epoxy Bonding Adhesive EG-2P-3005 is a quick setting sealant ideally made for materials with dissimilar surfaces where heat expansion may occur. It is also a flexible epoxy adhesive with a 1:1 mix ratio volume base accelerator. Additionally, the 3M™ adhesive can be applied through bonding, potting and rigidizing.