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Lapping-polishing plate - NEW LAM® M’M’
The NEW LAM MM poli-lapping system is patented and was launched 25 years ago by LAM PLAN and it was innovative with that launch. LAM PLAN has continued to respond to its customers technical requirements. Currently the system holds patents in Korea, Japan, United States, Europe, and France and in the lapping polishing process this is a must. Used for operation of free diamond compounds, the NEW LAM MM Plate is a derivative of the abrasion technique. The effect of the initial weight of the parts and the load applied , the diamond grains will move and fix production of the abrasive action. This is only beside the parts that are to be lapped. Optimum alteration between the hard and soft areas are allowed for the shape of the plates two components and their arrangement.