Molding encapsulation die machine - 9 kVA, max. 2273 x 1490 x 1976 mm | Fico AMS-W

Molding encapsulation die machine - 9 kVA, max. 2273 x 1490 x 1976 mm | Fico AMS-W
BE Semiconductor Industries The Fico AMS-W Top Foil from Besi is a fully-automated molding apparatus utilized for singular-sided MAP units, such as BOC, QFN, and even BGA. It sports an advanced top foil spec which enables it to operate and produce bare die units with zero bleeding. This top foil mechanism also enables the machine to disregard any cleaning or other maintenance services after the molding method.

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