Wafer cutting machine - CE/FDA/±4μm | QAC&BACL, LDC

Wafer cutting machine - CE/FDA/±4μm | QAC&BACL, LDC
Farley Laserlab The machine LDC-5142 adopts 1064nm in-fared laser as cutting tool which gives a greater cutting quality. The advantages of the machine LDC-5142 are fast speed, easier processes, low maintenance cost. It is very suitable...

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