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Die bonder fully-automatic - DB-800HS
The DB-800HS Die Bonder manufactured by Hitachi, offers high-speed Sip Assembling to semiconductor applications. Its framework comprises of a mechanical dispenser that delivers highly-precise paste application using a non-contact nozzle. It can control its height through a laser measuring component. It can also deliver a wide array of thermo-pressure bonding through the utilization of a substrate heater or collet heater. In addition, The DB-800HS Die Bonder can achieve thin Die handling by means of ultrasonic and multi-stage pickup.