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Multi-chip module - max. 1066 Mbps | KA, K5 series
Innovative "chip-stack" design optimizes board spaceFind out why leading manufacturers choose Samsung Multi-Chip Packages (MCPs) for applications where board space is extremely limited, such as smartphones and other mobile handsets, tablets, and multimedia players. MCP memory configurations are designed to support a growing list of device capabilities, expanding freedom and choice for users who want to do more with their mobile applications.
Unify memory technologies on a single substrate
Samsung MCPs combine different memory technologies, including single-level cell (SLC) NAND flash or eMMC and Mobile DRAM such as LPDDR1 (low-power DDR1) and LPDDR2 on a single substrate. This flexible approach is designed to deliver benefits including:
Enhanced memory and overall system performance through tight coupling and close positioning of memory modules to establish the shortest interconnections possible in a small, high-density package
Average 30 percent to 40 percent savings in board space for your end product through the stacking of several memory chips in a vertical configuration
Minimized bill-of-materials count for simplified manufacturing and cost savings
Accelerated time to market through rapid integration of MCP modules, speeding the pace of product development