Liquid-cooled heat sink

Liquid-cooled heat sink
ARCEL Our WPM water cooled heatsink enables to evacuate the calories produced by high power semiconductor modules.
The cold plate is optimized on its main face for the cooling of ECONOPACK+ and ECONODUAL modules, high power HVIGBT modules and MEGA POWER DUAL or PRIMEPACK modules.
The opposite face allows to use all the other modules with different sizes (diode modules, ISOTOP housing, 80mm pitch modules).

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