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Magnetron for ion sputtering
These rectangular magnetrons are typically designed with a side-to-side sweeping motion which is exploited to enhance target utilization. Sweeping can occur in any direction or combination of directions, but is usually limited to side-to-side. Target utilization for this type of magnetron is superior to that of static planar units, but can still be limited by cross corner or turn around trenching. Magnetic flux tunnel shaping can be incorporated to minimize or eliminate these production hindering features. Our patented Quadrature technology can also be integrated to:Sputter Through Thicker Targets
Sputter Through Magnetic Targets
Increase Deposition Rates
Lower Operating Voltages/Power