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Surface treatment machine plasma - FlexTRAK-CD
The FlexTRAK-CD plasma system is designed for high throughput processing of lead frame strips, laminated substrates, and other strip-type electronic components, up to 10 strips per plasma cycleSuperior Plasma Processing, Small Footprint, High-Throughput
The patented plasma chamber design provides high uniformity and process repeatability. It ensures all areas of the substrate are treated uniformly, while tight control over process parameters provides highly repeatable results.
The system accommodates a wide range of strip sizes, yielding unmatched production flexibility. Its small chamber volume and proprietary process control system provide short cycle times, with high machine autonomy.
Applications
Plasma for pre-die attach, pre-wire bond, pre-mold encapsulation and pre-underfill such as:
Contamination Removal & Surface Cleaning
Fluorine & other halogens
Metals & metal oxides
Organic compounds
Etching and Surface Roughening
Improve die adhesion & wire bonding
Improve mold adhesion & reduce delamination
Surface Activation
Improve die adhesive flow, eliminate voids and enhance adhesion
Improve mold material flow, eliminate voids and reduce wire sweep
Improve underfill flow, eliminate voids, enhance adhesion, and increase wicking speed