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In-line plasma cleaning system - PSX307
The PSX307 plasma cleaner provides 1.5 times the operation of conventional models which corresponds plate chamber technology that delivers superior etch uniformity over conventional batch systems. It has Ultra-thin gold-plated electrodes can be wire bonded reliably without nickel compound formation via argon plasma treatment. Gold plating savings alone can provide ROI justification.It is technically designed with a high-speed, uniform parallel plate plasma cleaner, a fast - up to 360 substrates/strips per hour and highly productive - inline processing for improved bonding, over molding and underfill semi S2/S8 compliant with Ar, O2 or mixed gas plasma