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UV laser cutting machine / wafer - 355 nm | LED UV/QAC&BACL
The LED UV/QAC&BACL, manufactured by Wuhan HuaGong Laser Engineering Co.,Ltd, is a UV laser wafer-dicing machine that adopts a UV laser source as well as a high precision worktable.The laser operates at 355 nm wavelength and 5W of power. The positioning resolution is rated at 1μm while precision of Z axis and the rotation axis are 1μm and 20" respectively. The resolution of XY grating ruler is at 0.1μm while the CC positioning precision is 1μm.
This machine operates with a cutting linear width range of 5-10μm and on a cutting depth and speed of 20-30μm and 100mm/s, respectively.