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Thermally conductive gap filler - THERM-A-GAP™ T630 Series
Gap Fillers from Chomerics are fully cured, thermally conductive, Bellcore-passed silicon chemical fillers that fill uneven or irregular gaps in electronic assemblies. This is a successful and convenient alternative to conventional filling pads that cause additional tension on electronic components, solder joints and leads, which cause mechanical shear of the circuit board.Gap filler is a viscoplastic paste that is fully cured and form stable with which negligible force is required to deform during electronic assembly. For applications requiring electrical isolation, compression stop filling can be achieved by using the "G" version of gap fillers that has glass beads.