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Thermally conductive gap filler - 0.2 - 14 mm | H series
The H series, which is manufactured by Shenzhen HFC Shielding, is a thermal pad that is ideal for use in power conversion components, in high-speed disk storage drives, and in engine control units. The series has an adequate compression rate with a thermal conductivity of 1.0 W/m.k and complies with the UL94 V-0 standard.