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• Signal connector / low-profile / high density / PCB - 2.54 x 1.27 mm, 2 A | C153

Signal connector / low-profile / high density / PCB - 2.54 x 1.27 mm, 2 A | C153

Offset-grid contacts layout, two contact rows within dielectric connector body
1.905mm center-to-center contact spacing in each row and 1.651 row-to-row spacing
0.5mm nominal pin DIA contact size; 57 contact positions; dip solder
SMT soldering or wored contact termination types
High contact density and durability, low profile and light weight. High shock and vibration proof (no micro interruptions - test: 2ns)
Conforms to MIL-DTL-55302

Smiths Connectors C153 2 contact row high density PCB signal connectors for military, test and burn-in systems for semiconductor industry.

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