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Fully-automatic X-ray inspection machine - VT-X700
For manufacturers that desire high-speed and in-line automation X-Ray inspection on PCBs, the Omron VT-X700 is the most suitable option. They contain components such as CSPs or BGAs with solder joints that are hidden. This model uses the most revolutionary, high precision, X-ray, and CT imaging for the performance of reliable and precise analysis of any hidden areas. Traditional AOI technology isn't capable of performing this level of inspection on any of these kinds of components. From a full-range of components, the VT-X700 can inspect solder quality on everything from BGAs to chips and even devices that are through-hole. At speeds of 5 seconds per field-of-view (fov), these inspections are performed very quickly. This system performs cross-sectional analysis using the proper slice-level locations through the usage of 3D reconstruction software and laser displacement technologies. This compensates for any warpage and the system is allowed to perform analysis of cross-sectional analysis.